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FLASHPRO-II: ADVANCED FLASH MEMORY ENGINEERING PROGRAMMER
     FLASHPRO-II: ADVANCED FLASH MEMORY ENGINEERING PROGRAMMER

Flash Memory Components Overview
Innovative Technology for Cost-Effective Solutions
Intel's Flash memory family features an extensive product line, giving customers the flexibility to select the best products for their application, from High Integration Boot Block, to High Performance Fast Flash, to High Value FlashFile™ memory components.

High Integration Boot Block
High Integration Boot Block components provide a single-chip solution for code or code/data with an optimal mix of small 8-Kbyte blocks and larger 64- and 128-Kbyte blocks on a single device. These components come in 2-, 4- 8- and 16- Mbit densities and provide an easy pin out compatible upgrade path in both TSOP and µBGA* packages. High Integration products are available in x8 or x16 buswidth configurations. Read and write voltage options span 2.7V through 5V, all with SmartVoltage Technology fast 12V production programming option. Read access performance is available from 60 nsec at 5V to 120 nsec at 2.7V. A hardware-lockable boot block ensures security for critical code storage.

The NEW Smart 3 Advanced Boot Block family provides the lowest cost solution for code and EEPROM data replacement in a single device. New features include, 4-, 8-, 16-Mbit family, eight 8-Kbyte data blocks, 64-Kbyte main blocks, 2.7V to 3.6V read/write/erase, 1.8V I/O, fast 12V production programming, fast write and write suspend functions and µBGA packaging . Along with FDI software, the Smart 3 Advanced Boot Block is an ideal solution for space constrained battery applications that require a low cost, integrated code + data solution. Applications include cellular phones, pagers, PCMCIA cards, and organizers.

The Smart 5 Boot Block family comes in 2-, 4-, and 8-Mbit densities, providing the same easy upgrade path as our full featured SmartVoltage products-- at a much lower cost. Smart 5 Boot Block flash products read at 5V and maintain SmartVoltage's 5V or 12V Vpp for simple in-system updates plus fast factory programming. These products offer a hardware-lockable boot block to ensure security for critical code and are configurable for x8 or x16 operation.

High-Performance Fast Flash
To meet high performance requirements, many embedded systems store code in nonvolatile memory (NVM) such as ROM, EPROM or flash and shadow this code to DRAM for execution. Fast Flash memories, with their optimized system-read interfaces, have the performance, nonvolatility and updating capacity to replace redundant DRAM + NVM for code storage/execution and reduced system cost. The synchronous, effective 0-wait-state, burst-read interface of the 28F016XS makes it ideal for residing on the local bus of burst-mode processors, such as the i960® and the Intel486™ processors. The DRAM system read interface of the 28F016XD is optimized for designs such as embedded PC motherboards and anywhere a DRAM bus architecture is used.

All Fast Flash devices feature SmartVoltage technology, providing the fastest-available, 5V-only write performance and even higher performance 12V device writes. SmartVoltage technology also supports 3.3V reads, as well as high performance 5V reads.

Because these devices feature the architecture of Intel's FlashFile™ memories, they are ideal for solid-state mass storage applications such as resident flash disks (RFDs). Valuable mass storage features include an integrated flash controller that supports SRAM-speed burst write performance and advanced command-set queuing to off load system resources during flash erase/write cycles.

High Value FlashFile™ Memory
Intel's symmetrically-blocked FlashFile™ memory family provides the widest range of high density, mass storage flash devices available today. Intel's strong technology track record, excellent quality and volume manufacturing experience establishes the company as the leader in high density flash memory.

The FlashFile memory architecture is partitioned into independently erasable 64-Kbyte blocks, making it optimal for partial code updates or file storage applications. These blocks are independently lockable on all family members except the first generation 8-Mbit 28F008SA. This feature enables protection of important firmware such as operating systems and application programs from being inadvertently erased.

The command set for the 8-Mbit 28F008SA is supported by all of the family members, which allows design migration throughout the device density range without system software changes. The newest family members, the Smart 3, Smart 5 and SmartVoltage FlashFile components expand the byte-wide FlashFile memory family to provide the lowest cost per bit flash solution for high density applications. FlashFile products are pinout and package compatibile for easy upgrades and feature 4-, 8-, and 16-Mbit densities. These new byte-wide FlashFile memories features SmartVoltage technology which enables fast programming and low power designs.

The 28F016SA, 28F016SV and 28F032SA devices also have an integrated flash controller that supports 14.3 Mbyte/sec. burst write performance, and advanced command-set queuing to off-load system resources during flash erase/write cycles. The 28F016SV also features SmartVoltage technology. These 16- and 32-Mbit devices are also configurable as x8 or x16, which is ideal for 16- and 32-bit bus applications.

First Generation Bulk Erase
The bulk array flash components (1-Mbit, 2-Mbit) were designed for EPROM-type replacement applications. These devices offer 12V write, 5V read, and non-automated program/erase algorithms.

A Complete Flash Memory Solution
When integrating flash memory into your system designs, look to Intel's full range of Flash Memory Tools to give your development schedule a boost. You'll find everything you need to solve design problems, simplify the development process and improve product capabilities.

Intel has worked closely with leading hardware and software vendors to develop the most advanced and inclusive development tools suite available. This includes software for file/data storage and in-system code updates, programmers for storing information to flash memory in system development and manufacturing, plus tools for designing flash memory into your applications long before you have samples. Intel is committed to providing a full range of development tools necessary to make our flash memory the easiest to use in the industry.

Flash Memory Components Feature Comparison
 
Commercial Temperature

     

Access
Time (ns)

Access
Time (ns)

Access
Time (ns)

     

Density

Product

Organization

4.5 – 5.5V VCC

3.0 – 3.6V VCC

2.7 – 3.6V VCC

VPP

Package

Number Pins

HIGH INTEGRATION BOOT BLOCK FLASH MEMORY COMPONENTS- Application-Optimized Block Sizes
8 Mb 28F800B5 1M x 8 or
512K x 16
70, 90     5V or 12V TSOP

48

  28F800B5 1M x 8 or
512K x 16
70, 90     5V or 12V PSOP

44

  28F800BV 1M x 8 or
512K x 16
70, 120 120, 150   5V or 12V PSOP

44

  28F800CV 1M x 8 or
512K x 16
70, 120 120, 150   5V or 12V TSOP

48

  28F008BV 1M x 8 70, 120 120, 150   5V or 12V TSOP

40

                 
4 Mb 28F400B5 512K x 8 or
256K x 16
60, 80     5V or 12V TSOP

48

  28F400B5 512K x 8 or
256K x 16
60, 80     5V or 12V PSOP

44

  28F400BV 512K x 8 or
256K x 16
60, 80 110, 150   5V or 12V TSOP

56

  28F400BV 512K x 8 or
256K x 16
60, 80, 120 110, 150, 180   5V or 12V PSOP

44

  28F400CV 512K x 8 or
256K x 16
60, 80 110, 150   5V or 12V TSOP

48

  28F004BV 512K x 8 60, 80, 120 110, 150, 180   5V or 12V TSOP

40

                 
2 Mb 28F200B5 256K x 8 or
128K x 16
60, 80     5V or 12V TSOP

48

  28F200B5 256K x 8 or
128K x 16
60, 80     5V or 12V PSOP

44

  28F002BC 256K x 8 80, 120     12V TSOP PDIP

40

  28F002BC 256K x 8 80, 120     12V PSOP

44

  28F200BV 256K x 8 or
128K x 16
60, 80 110, 150   5V or 12V TSOP

56

  28F200BV 256K x 8 or
128K x 16
60, 80, 120 110, 150, 180   5V or 12V PSOP

44

  28F200CV 256K x 8 or
128K x 16
60, 80 110, 150   5V or 12V TSOP

48

  28F002BV 256K x 8 60, 80, 120 110, 150, 180   5V or 12V TSOP

40

                 
1 Mb 28F001BX 128K x 8 70, 90, 120, 150     12V PDIP PLCC TSOP

32

HIGH-PERFORMANCE FLASH MEMORY COMPONENTS- Symmetrically-Blocked Fast Flash Architecture
16 Mb 28F016XS 2M x 8 or
1M x 16
0 WS 33 MHz

0 WS 25 MHz

0 WS 25 MHz

0 WS 20 MHz

  5V or 12V TSOP SSOP

56

  28F016XD 1M x 16 85 (random)

65 (page mode)

95 (random)

75 (page mode)

  5V or 12V TSOP

56

HIGH VALUE FLASH MEMORY COMPONENTS- Symmetrically-Blocked FlashFile(TM) Architecture
32 Mb 28F032SA 4M x 8 or
2M x 16
70, 100 150   12V TSOP(DD)

56

                 
16 Mb 28F016S5 2M x 8 95, 120     5V or 12V TSOP

40

  28F016S5 2M x 8 95, 120     5V or 12V PSOP

44

  28F016S3 2M x 8   120, 150 150, 170 3.3V or 12V TSOP µBGA*

40

  28F016S3 2M x 8   120, 150 150, 170 3.3V or 12V PSOP

44

  28F016SC 2M x 8 95, 120 120, 150 150, 170 3.3V, 5V or 12V TSOP µBGA

40

  28F016SV 2M x 8 or
1M x 16
65, 70 75, 120   5V or 12V TSOP SSOP

56

  28F016SA 2M x 8 or
1M x 16
70, 100 120, 150   12V TSOP SSOP

56

                 
8 Mb 28F008S5 1M x 8 85, 120     5V or 12V TSOP

40

  28F008S5 1M x 8 85, 120     5V or 12V PSOP

44

  28F008S3 1M x 8   120, 150 150, 170 3.3V or 12V TSOP µBGA

40

  28F008S3 1M x 8   120, 150 150, 170 3.3V or 12V PSOP

44

  28F008SC 1M x 8 85, 120 120, 150 150, 170 3.3V, 5V or 12V TSOP µBGA

40

  28F008SA

28F008SA

1M x 8

1M x 8

85, 120

85, 120

    12V

12V

TSOP (E/F)

PSOP

40

44

  28F008SA-L 1M x 8   200   12V TSOP

40

                 
4 Mb 28F004S5 512K x 8 85, 120     5V or 12V TSOP

40

  28F004S5 512K x 8 85, 120     5V or 12V PSOP

44

  28F004S3 512K x 8   120, 150 150, 170 3.3V or 12V TSOP

40

  28F004S3 512K x 8   120, 150 150, 170 3.3V or 12V PSOP

44

  28F004SC 512K x 8 85, 120 120, 150 150, 170 3.3V, 5V or 12V TSOP

40

FIRST GENERATION FLASH MEMORY COMPONENTS- Bulk Erase
2 Mb 28F020 256K x 8 70, 90, 120, 150     12V PDIP PLCC TSOP (E/F)

32

                 
1 Mb 28F010 128K x 8 65, 90, 120, 150     12V PDIP PLCC TSOP (E/F)

32

Extended Temperature
     

Access
Time (ns)

Access
Time (ns)

Access
Time (ns)

   

 

Density

Product

Organization

4.5—5.0V VCC

3.0—3.6V VCC

2.7—3.6V VCC

VPP

Package

Number Pin/Ball

HIGH-INTEGRATION BOOT BLOCK FLASH MEMORY COMPONENTS- Application-Optimized Block Sizes
16 Mb 28F160B3 1M x 16     120, 150

1.8V I/O

2.7-3.6V or 12V TSOP µBGA

48

                 
8 Mb 28F800B3 512K x 16     120, 150

1.8V I/O

2.7-3.6V or 12V TSOP µBGA

48

  28F800B5 1M x 8 or
512K x 16
90     5V or 12V TSOP

48

  28F800B5 1M x 8 or 512K x 16 90     5V or 12V PSOP

44

  28F800BV 1M x 8 or
512K x 16
90 120   5V or 12V PSOP

44

  28F800CV 1M X 8 or
512K x 16
90 120   5V or 12V TSOP

48

  28F008BV 1M X 8 90 120   5V or 12V TSOP

40

  28F008BE 1M X 8 90   120 5V or 12V TSOP

40

  28F800CE 1M X 8 or
512K x 16
90   120 5V or 12V TSOP

48

                 
4 Mb 28F400B3 256K x 16     120, 150

1.8V I/O

2.7-3.6V or 12V TSOP

48

  28F400B5 512K x 8 or
256K x 16
80     5V or 12V TSOP

48

  28F400B5 512K x 8 or
256K x 16
80     5V or 12V PSOP

44

  28F400BV 512K x 8 or
256K x 16
80 110   5V or 12V TSOP

56

  28F400BV 512K x 8 or
256K x 16
80 110   5V or 12V PSOP

44

  28F400CV 512K x 8 or
256K x 16
80 110   5V or 12V TSOP

48

  28F004BV 512K x 8 80 110   5V or 12V TSOP

40

  28F004BE 512K x 8 80   120 5V or 12V TSOP

40

  28F400CE 512K x 8 or
256K x 16
80   120 5V or 12V TSOP

48

                 
2 Mb 28F200B5 256K x 8 or
128K x 16
80     5V or 12V TSOP

48

  28F200B5 256K x 8 or
128K x 16
80     5V or 12V PSOP

44

  28F200BV 256K x 8 or
128K x 16
80 110   5V or 12V TSOP

56

  28F200BV 256K x 8 or
128K x 16
80 110   5V or 12V PSOP

44

  28F200CV 256K x 8 or
128K x 16
80 110   5V or 12V TSOP

48

  28F002BV 256K x 8 80 110   5V or 12V TSOP

40

                 
1 Mb 28F001BX 128K x 8 90, 150     12V PDIP PLCC TSOP

32

HIGH-VALUE FLASH MEMORY COMPONENTS- Symmetrically-Blocked FlashFile(TM) Architecture
16 Mb 28F016SA 2M x 8 or
1M x 16
100 150   12V SSOP

56

  28F016SV 2M x 8 or
1M x 16
80 100   5V or 12V SSOP

56

                 
8 Mb 28F008S5 1M x 8 100     5V or 12V TSOP

40

  28F008S5 1M x 8 100     5V or 12V PSOP

44

  28F008S3 1M x 8   150 170 3.3V or 12V TSOP

40

  28F008S3 1M x 8   150 170 3.3V or 12V PSOP

44

  28F008SC 1M x 8 100 150 170 3.3V, 5V or 12V TSOP

40

  28F008SA 1M x 8 100     12V TSOP (E/F)

40

  28F008SA 1M x 8 100     12V PSOP

44

FIRST-GENERATION FLASH MEMORY COMPONENTS- Bulk Erase
2 Mb 28F020 256K x 8 90, 120, 150     12V PDIP PLCC TSOP (E/F)

32

                 
1 Mb 28F010 128K x 8 90, 120, 150     12V PDIP PLCC TSOP (E/F)

32


New Product Availability Schedule:

Commercial Temperatures
Product Package Samples Production
28F800B5 TSOP,PSOP now now
28F400B5 TSOP,PSOP now now
28F200B5 TSOP,PSOP now now
28F016S5 TSOP,PSOP Q2’97 Q3’97
28F016S3
TSOP,PSOP
µBGA
Q2’97
Q3’97
Q3’97
Q4’97
28F016SC
TSOP
µBGA
Q2’97
Q3’97
Q3’97
Q4’97
28F008S5 TSOP,PSOP now now
28F008S3 TSOP,PSOP,µBGA now now
28F004S5 TSOP,PSOP Q2’971 Q3’97
28F004S3 TSOP,PSOP Q2’971 Q3’97

Extended Temperatures
Product Package Samples Production
28F160B3
TSOP
µBGA
Q2’97
Q2’97
Q3’97
Q1’98
28F800B3 TSOP,µBGA Q3’97 Q3’97
28F400B3 TSOP Q4’97 Q4’97

1Use 8Mb samples for your 4 Mb designs.



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