Intel Packaging Databook

PURPOSE OF THE DATABOOK

Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. Each of the twelve chapters provide a comprehensive and in-depth analysis of Intel's packaging technology, from information on IC assembly, package performance characteristics, and physical constants, to detailed discussions of surface mount technology and Intel shipping and packing.

Chapter 1: INTRODUCTION
An analysis of Intel's package families, including package attributes, package types, and a package selection guide.
Chapter 2: PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
A detailed view into Intel package module outlines and dimensions.
Chapter 3: IC ASSEMBLY TECHNOLOGY
The chapter begins with a brief introduction and a discussion of statistical tools used in the manufacturing process. It also includes a comprehensive analysis of Intel's IC assembly process flow.
Chapter 4: PERFORMANCE CHARACTERISTICS
Package characteristics and in-depth data for electrical, mechanical, and thermal IC package characteristics.
Chapter 5: PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
The charts in this chapter provide valuable information on mechanical, electrical, and thermal properties of case materials, lead/lead frames, and soldering material Charateristics.
Chapter 6: COMPONENT HANDLING PRECAUTIONS
ESD/EOS precautions describes electrical static discharge and electrical over stress.
Chapter 7: SURFACE MOUNT TECHNOLOGY
Surface mount technology.
Chapter 8: MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
Desiccant Packing Methods, Materials, Moisture Sensitivity and Package Cracking are examined.
Chapter 9: BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS
An in-depth analysis of Board Solder Reflow Process.
Chapter 10: TRANSPORT MEDIA AND PACKING
Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are clearly illustrated.
Chapter 11: INTERNATIONAL PACKAGING SPECIFICATIONS
A listing of international packaging specifications and a comprehensive resource library.
Chapter 12: ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE
Packaging technology at Intel. The Tape Carrier Package.
Chapter 13: PLASTIC PIN GRID ARRAY PACKAGING
An introduction to the Plastic Pin Grid Array package technology.
Chapter 14: PLASTIC BALL GRID ARRAY PACKAGING
A profile of the Platic Ball Grid Array package technology.
Chapter 15: GLOSSARY
Defintion of Packaging Databook terms.
Revised 12/19/96