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Intel Packaging Databook

PURPOSE OF THE DATABOOK

Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. Each of the twelve chapters provide a comprehensive and in-depth analysis of Intel's packaging technology, from information on IC assembly, package performance characteristics, and physical constants, to detailed discussions of surface mount technology and Intel shipping and packing.

Chapter 1: INTRODUCTION

An analysis of Intel's package families, including package attributes, package types, and a package selection guide.

Chapter 2: PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS

A detailed view into Intel package module outlines and dimensions.

Chapter 3: IC ASSEMBLY TECHNOLOGY

The chapter begins with a brief introduction and a discussion of statistical tools used in the manufacturing process. It also includes a comprehensive analysis of Intel's IC assembly process flow.

Chapter 4: PERFORMANCE CHARACTERISTICS

Package characteristics and in-depth data for electrical, mechanical, and thermal IC package characteristics.

Chapter 5: PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS

The charts in this chapter provide valuable information on mechanical, electrical, and thermal properties of case materials, lead/lead frames, and soldering material Charateristics.

Chapter 6: COMPONENT HANDLING PRECAUTIONS

ESD/EOS precautions describes electrical static discharge and electrical over stress.

Chapter 7: SURFACE MOUNT TECHNOLOGY

Surface mount technology.

Chapter 8: MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs

Desiccant Packing Methods, Materials, Moisture Sensitivity and Package Cracking are examined.

Chapter 9: BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS

An in-depth analysis of Board Solder Reflow Process.

Chapter 10: TRANSPORT MEDIA AND PACKING

Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are clearly illustrated.

Chapter 11: INTERNATIONAL PACKAGING SPECIFICATIONS

A listing of international packaging specifications and a comprehensive resource library.

Chapter 12: ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE

Packaging technology at Intel. The Tape Carrier Package.

Chapter 13: PLASTIC PIN GRID ARRAY PACKAGING

An introduction to the Plastic Pin Grid Array package technology.

Chapter 14: PLASTIC BALL GRID ARRAY PACKAGING

A profile of the Platic Ball Grid Array package technology.

Chapter 15: GLOSSARY

Defintion of Packaging Databook terms.

Revised 12/19/96




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