Chapter 1: INTRODUCTIONAn analysis of Intel's package families, including package attributes, package types, and a package selection guide.
Chapter 2: PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONSA detailed view into Intel package module outlines and dimensions.
Chapter 3: IC ASSEMBLY TECHNOLOGYThe chapter begins with a brief introduction and a discussion of statistical tools used in the manufacturing process. It also includes a comprehensive analysis of Intel's IC assembly process flow.
Chapter 4: PERFORMANCE CHARACTERISTICSPackage characteristics and in-depth data for electrical, mechanical, and thermal IC package characteristics.
Chapter 5: PHYSICAL CONSTANTS OF IC PACKAGE MATERIALSThe charts in this chapter provide valuable information on mechanical, electrical, and thermal properties of case materials, lead/lead frames, and soldering material Charateristics.
Chapter 6: COMPONENT HANDLING PRECAUTIONSESD/EOS precautions describes electrical static discharge and electrical over stress.
Chapter 7: SURFACE MOUNT TECHNOLOGYSurface mount technology.
Chapter 8: MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCsDesiccant Packing Methods, Materials, Moisture Sensitivity and Package Cracking are examined.
Chapter 9: BOARD SOLDER REFLOW PROCESS RECOMMENDATIONSAn in-depth analysis of Board Solder Reflow Process.
Chapter 10: TRANSPORT MEDIA AND PACKINGVarious packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are clearly illustrated.
Chapter 11: INTERNATIONAL PACKAGING SPECIFICATIONSA listing of international packaging specifications and a comprehensive resource library.
Chapter 12: ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGEPackaging technology at Intel. The Tape Carrier Package.
Chapter 13: PLASTIC PIN GRID ARRAY PACKAGINGAn introduction to the Plastic Pin Grid Array package technology.
Chapter 14: PLASTIC BALL GRID ARRAY PACKAGINGA profile of the Platic Ball Grid Array package technology.
Chapter 15: GLOSSARYDefintion of Packaging Databook terms.
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