• Market Trends
• What are Die?
• Intel's SmartDie Products vs. "The Myths"
• The Intel Solution
• Product Support
• Intel SmartDie Product Solutions

Mobile Computing Market:

• Notebooks, sub-notebooks, pen tablet computers
• Mobile Companions, personal digital assistants, organizers
• Hand-held embedded PCs and handy terminals for factory automation, point-of-sale terminals, and other vertical market applications

• Analog and digital cellular phones
• Pagers and other wireless devices
• Smart phones and other multifunction mobile communicators

What are Die?
Basically, die are semiconductor chips without any packaging. Chips come in a variety of packages, which are different sizes and shapes. The problem is that many packages are too bulky for tomorrow's small form-factor systems. For example, the die version of the Intel486™ processor is only 12 percent of the total area of the packaged version, and 25 percent of the height. Up to five-to-one gains in overall circuit board real estate savings are not uncommon with die versions vs. packaged chips. This gain gives manufacturers the ability to get the same functionality in a much smaller space. In other words, die solutions can enable the smaller, thinner and lighter end products consumers want.

SmartDie products are the unpackaged die in Intel's die product line which provide the same levels of quality, reliability, performance and support as their packaged counterparts.

Intel's SmartDie™ Products vs. "The Myths"
Although die level products are not the right choice for every application, they can provide a significant size advantage for systems that require the smallest form factor available. There are a lot of myths floating around that often prevent design, product development and manufacturing engineers from fully exploring die as an option. Right now is a good time to debunk the myths about die.

Myth #1: Die is not an option because it's too expensive.
In the past, this may have been the case because semiconductor companies weren't set up to handle die sales. A customer buying untested die faced uncertain manufacturing yields and associated rework costs. Even if the customer could buy "Known Good Die," they usually paid a stiff price premium. Today, however, Intel has the testing infrastructure in place to deliver SmartDie products that are comparable to its packaged components. In addition, fully-tested SmartDie products are priced at parity with their packaged counterparts.

Myth #2: Large semiconductor companies such as Intel would never sell die. Again, in the past this may have been the case. Selling die was not available with many companies' product offerings.

Today's system manufacturer's, however, are demanding die-level products to develop smaller and more mobile products causing a dramatic increase in die sales through the end of the decade. Intel will continue to offer more SmartDie Product options, including certain versions of its industry standard processors, embedded microprocessors and flash memories.

Myth #3: Even if you could get them, die aren't that much smaller anyway.
The absolute smallest package you can get is no package at all: unpackaged die. Die are the smallest form factor available today. Up to five-to-one reductions in circuit board area are not uncommon using die.

Myth #4: There is no product support available for die-level products.
The "You buy it, you own it" mentality is gone. Intel now offers full support for die products including complete product documentation and die-specific application and manufacturing support.

The Intel Solution
Intel's SmartDie products take the guesswork out of die level products by meeting the same quality and performance standards as packaged products. With Intel SmartDie products, customers get the same quality, reliability, support and price as with traditional packaged components. For example, the quality and reliability processes for Intel SmartDie products are equivalent to its packaged products. These include:

• Full speed testing/parametrics (AC/DC)
• Screening for operation over at least a 0 degrees C - 80 degrees C (Junction) temperature range.
• Die level burn-in when required
• 100-percent visual inspections during processing and packing
• Full product support from Intel
• Comparable cost to traditional packaged components
• Standard sales and distribution channels.

Intel is working closely with TAP participants to provide them with technical and product support. Customers can then choose the TAP partner that best suits their needs.

Whether dealing through TAP or working directly with the end customer, Intel dedicates factory resources to assist with die-level products. Multi-discipline support teams are available to help customers with die-level design and manufacturing process issues. Intel offers comprehensive customer support for its SmartDie products, including return material authorization and functional analysis and correlation report support.

Intel SmartDie Product Solutions
We live in a world made smaller by increasingly dazzling computer and communication options. As the 21st century unfolds, our ability to develop smaller and lighter products is limited only by our imagination. Intel SmartDie Products enable tomorrow's small form-factor designs.

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