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TSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)


Architecture:
Type :
Last Update:

FLASH Fast Flash_Component
Packaging Information
11/11/96 3:41:00 PM

Vendor Information



Tool Description:

Provides package and land-pad dimensions for all lead count TSOP packages.

Tool Features:

  • Document 2290 contains information about This Small Outline Packages (TSOP).

  • Including package and land-pad drawings and tables with critical dimensions.
  • File Attachments:

    2290.DOC -

    Supported Device Detail Matrix:

    Part & Package

    28F016XD - TSOP-56 ld
    28F016XS - TSOP-56 ld



    Vendor Information:


    Intel Corp. (Folsom)

    1900 Prairie City Road
    Folsom , CA 95630
    USA

    Tech : (916) 356-3104
    Email : flash@inside.intel.com
    Fax : (916) 356-2803
    Toll Free : (800) 628-8686
    BBS : (916) 356-3600
    URL : http://developer.intel.com

    Contact the vendor above for the latest Distributor information




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