TSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

FLASH Bulk-Erase_Component
Packaging Information
11/11/96 3:41:00 PM

Vendor Information

Tool Description:

Provides package and land-pad dimensions for all lead count TSOP packages.

Tool Features:

Document 2290 contains information about This Small Outline Packages (TSOP).

Including package and land-pad drawings and tables with critical dimensions.

File Attachments:

2290.DOC -

Supported Device Detail Matrix:

Part & Package

28F010 - TSOP-32 ld
28F010 - TSOP-32 ld(R)
28F020 - TSOP-32 ld
28F020 - TSOP-32 ld(R)

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

	Part & Package
	28F010 - TSOP-32 ld 28F010 - TSOP-32 ld(R) 28F020 - TSOP-32 ld 28F020 - TSOP-32 ld(R)

TSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)

Vendor Information:

Intel Corp. (Folsom)