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TSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)


Architecture:
Type :
Last Update:

FLASH Boot Block_Component
Packaging Information
11/11/96 3:41:00 PM

Vendor Information



Tool Description:

Provides package and land-pad dimensions for all lead count TSOP packages.

Tool Features:

  • Document 2290 contains information about This Small Outline Packages (TSOP).

  • Including package and land-pad drawings and tables with critical dimensions.
  • File Attachments:

    2290.DOC -

    Supported Device Detail Matrix:

    Part & Package

    28F001BX - TSOP-32 ld
    28F002BC - TSOP-40 ld
    28F002BV - TSOP-40 ld
    28F002BX/BL - TSOP-40 ld
    28F004BV/BE - TSOP-40 ld
    28F004BX/BL - TSOP-40 ld
    28F008BV/BE - TSOP-40 ld
    28F200B5 - TSOP-48 ld
    28F200BV - TSOP-56 ld
    28F200BX/BL - TSOP-56 ld
    28F200CV - TSOP-48 ld
    28F400B5 - TSOP-48 ld
    28F400BV - TSOP-56 ld
    28F400BX/BL - TSOP-56 ld
    28F400CV/CE - TSOP-48 ld
    28F800B5 - TSOP-48 ld
    28F800CV/CE - TSOP-48 ld



    Vendor Information:


    Intel Corp. (Folsom)

    1900 Prairie City Road
    Folsom , CA 95630
    USA

    Tech : (916) 356-3104
    Email : flash@inside.intel.com
    Fax : (916) 356-2803
    Toll Free : (800) 628-8686
    BBS : (916) 356-3600
    URL : http://developer.intel.com

    Contact the vendor above for the latest Distributor information




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