SSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

FLASH Fast Flash_Component
Packaging Information
6/6/96 8:00:00 PM

Vendor Information

Tool Description:

Provides package and land-pad dimensions for 56L SSOP package.

Tool Features:

File Attachments:

2231.DOC -

Supported Device Detail Matrix:

Part & Package

Status

28F016XS - SSOP-56 ld

Released

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

SSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)

Vendor Information:

Intel Corp. (Folsom)