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IBIS Model for 28F001BX

Intel Corp. (Folsom)


Architecture:
Type :
Last Update:

FLASH Boot Block_Component
Simulation Models

Vendor Information



Tool Description:

An IBIS (I/O Buffer Information Specification) model is a behavioral description of the I/O buffers and packaging electrical characteristics of a flash device. These models provide information such as I/V curves, package characteristics and rise/fall times, all measured at various voltages and temperatures. IBIS models can be used in SPICE simulators by importing the ASCII IBIS text file into SPICE. These models have passed the Golden Parser and are based on actual device lab measurements, not simulation results.

Tool Features:

  • Model the analog characteristics of I/O buffers

  • Used to perform PCB interconnect simulations

  • Resolves compatibility issues when upgrading devices

  • Can be imported into SPICE
  • File Attachments:

    01BXIBIS.ZIP - Contains IBIS models for the 28F001BX.
    SOLF_031.PDF - SolutionsFlash Memory Catalog Product Listing

    Supported Device Detail Matrix:

    Part & Package

    Revision

    Status

    Availability

    28F001BX - TSOP-32 ld

    1.0

    Released

    4/9/96



    Vendor Information:


    Intel Corp. (Folsom)

    1900 Prairie City Road
    Folsom , CA 95630
    USA

    Tech : (916) 356-3104
    Email : flash@inside.intel.com
    Fax : (916) 356-2803
    Toll Free : (800) 628-8686
    BBS : (916) 356-3600
    URL : http://developer.intel.com

    Contact the vendor above for the latest Distributor information




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