IBIS Model for 28F001BX

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

FLASH Boot Block_Component
Simulation Models

Vendor Information

Tool Description:

An IBIS (I/O Buffer Information Specification) model is a behavioral description of the I/O buffers and packaging electrical characteristics of a flash device. These models provide information such as I/V curves, package characteristics and rise/fall times, all measured at various voltages and temperatures. IBIS models can be used in SPICE simulators by importing the ASCII IBIS text file into SPICE. These models have passed the Golden Parser and are based on actual device lab measurements, not simulation results.

Tool Features:

Model the analog characteristics of I/O buffers

Used to perform PCB interconnect simulations

Resolves compatibility issues when upgrading devices

Can be imported into SPICE

File Attachments:

01BXIBIS.ZIP - Contains IBIS models for the 28F001BX.
SOLF_031.PDF - SolutionsFlash Memory Catalog Product Listing

Supported Device Detail Matrix:

Part & Package
Revision
Status
Availability

28F001BX - TSOP-32 ld
1.0
Released
4/9/96

Vendor Information:

Intel Corp. (Folsom)

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

	Part & Package		Revision		Status		Availability
	28F001BX - TSOP-32 ld		1.0		Released		4/9/96