The Intel Mobile Module is a small, highly integrated assembly designed to contain the Intel mobile Pentium® processor with MMX™ technology and its immediate system-level support, including all required electronic circuits.

Functionality:

• Intel Pentium® processor with MMX™ technology
• Intel 430TX PCIset System Controller
• High performance Pipeline Burst Static RAM L2 Cache (PB SRAM)
• Voltage regulation for processor-specific requirements
• Clock circuit for systems with EDO DRAM Tape Carrier Package

Product Family Features:

• Supports 3.3-volt PCI bus
• Supports systems using Intel's 430TX PCI I/O ISA/IDE Xcelerator
• Fastest available memory performance
• Advanced EMI reduction design
• Flexible mechanical interface supports various techniques to dissipate Intel Mobile Module thermal output
• Sized to fit most mobile systems: 4 inches (101.6 mm) long by 2.5 inches (63.5 mm) wide by 0.315 inches (8 mm) high (0.39 inches or 10 mm high at connector)
• Support for ACPI

The Intel Mobile Module contains the power supply for the processor's unique voltage requirements, the system's Level 2 cache memory and the core logic required to "bridge" the processor to standard system buses. The module interfaces electrically to its host system via a 3.3-volt PCI bus, a 3.3-volt memory bus, and Intel 430TX PCIset control signals (bridging half of the chipset on the module to the other half of the chipset in the peripheral electronics). The Intel Mobile Module also defines a single thermal connection which carries all of the module's thermal output to the notebook's main cooling mechanisms. The Intel Mobile Module uses mounting screws and alignment guides to secure the module against the typical shock and vibration associated with notebook usage.

The mechanical, thermal and electrical interfaces of the Intel Mobile Module have been designed with the future in mind. It will be possible for Intel to produce future Intel Mobile Modules which deliver new processors while maintaining these interfaces. Future Intel Mobile Modules supporting these common interfaces will help notebook makers deliver their new, higher performance products to market faster. Because the Intel Mobile Module carries with it all the dedicated hardware needed to support the new processors, notebook OEMs can update their systems without applying their own engineering resources to processor-related redesign. The architecture of the Intel Mobile Module allows such updates -- even from one processor generation to the next. The resulting freed up engineering resources can be applied to improving and adding other features of the notebook design thus improving the general state of mobile computing. Finally, because the Intel Mobile Module's interfaces allow the module to be installed toward the end of a notebook's manufacturing cycle, notebook providers also gain added flexibility such as just-in-time manufacturing and simpler inventory management.