As Intel microprocessors become faster, more complex and more powerful, the demand on high-performance packaging technology increases. For instance, higher clock rates imply faster internal signals, which may cause more switching noise. Thus packaging technology needs to tackle power supply decoupling issues. For each new generation of microprocessors, a greater number of transistors are packed onto each chip, generating more heat. The package thermal resistance becomes critical. Furthermore the shrinking die size causes higher power density, which tests the effectiveness of the package to dissipate the heat. The improvements in microprocessor speed and functionality drive the package design improvements in electrical, thermal and mechanical performance. This document describes the latest in microprocessors packaging technology, the Plastic Pin Grid Array (PPGA) Package.
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