80C18xXL Pinout and Packaging Information

80C18xXL Pinout and Packaging Information

Table 4. LCC/PLCC Pin Functions with Location

AD Bus		Bus Control		Processor Control		I/O		Power and Ground
AD0	17	ALE/QS0	61	RES	24	UCS	34	V_CC	9
AD1	15	BHE (RFSH)	64	RESET	57	LCS	33	V_CC	43
AD2	13	S0	52	X1	59	MCS0/PEREQ	38	V_SS	26
AD3	11	S1	53	X2	58	MCS1/ERROR	37	V_SS	60
AD4	8	S2	54	CLKOUT	56	MCS2	36
AD5	6	RD/QSMD	62	TEST/BUSY	47	MCS3/NPS	35
AD6	4	WR/QS1	63	NMI	46	PCS0	25
AD7	2	ARDY	55	INT0	45	PCS1	27
AD8 (A8)	16	SRDY	49	INT1/SELECT	44	PCS2	28
AD9 (A9)	14	DEN	39	INT2/INTA0	42	PCS3	29
AD10 (A10)	12	DT/R	40	INT3/INTA1	41	PCS4	30
AD11 (A11)	10	LOCK	48			PCS5/A1	31
AD12 (A12)	7	HOLD	50			PCS6/A2	32
AD13 (A13)	5	HLDA	51			TMR IN 0	20
AD14 (A14)	3					TMR IN 1	21
AD15 (A15)	1					TMR OUT 0	22
A16/S3	68					TMR OUT 1	23
A17/S4	67					DRQ0	18
A18/S5	66					DRQ1	19
A19/S6	65

NOTE: Pin names in parantheses apply to the 80C188XL.

Table 5. LCC/PGA/PLCC Pin Locations with Pin Names

1	AD15 (A15)	18	DRQ0	35	MCS3/NPS	52	S0
2	AD7	19	DRQ1	36	MCS2	53	S1
3	AD14 (A14)	20	TMR IN 0	37	MCS1/ERROR	54	S2
4	AD6	21	TMR IN 1	38	MCS0/PEREQ	55	ARDY
5	AD13 (A13)	22	TMR OUT 0	39	DEN	56	CLKOUT
6	AD5	23	TMR OUT 1	40	DT/R	57	RESET
7	AD12 (A12)	24	RES	41	INT3/INTA1	58	X2
8	AD4	25	PCS0	42	INT2/INTA0	59	X1
9	V_CC	26	V_SS	43	V_CC	60	V_SS
10	AD11 (A11)	27	PCS1	44	INT1/SELECT	61	ALE/QS0
11	AD3	28	PCS2	45	INT0	62	RD/QSMD
12	AD10 (A10)	29	PCS3	46	NMI	63	WR/QS1
13	AD2	30	PCS4	47	TEST/BUSY	64	BHE (RFSH)
14	AD9 (A9)	31	PCS5/A1	48	LOCK	65	A19/S2
15	AD1	32	PCS6/A2	49	SRDY	66	A18/S3
16	AD8 (A8)	33	LCS	50	HOLD	67	A17/S4
17	AD0	34	UCS	51	HLDA	68	A16/S3

Note: Pin names in parentheses apply to the 80C188XL.

Table 6. QFP Pin Functions with Location

AD Bus Bus Control Processor Control I/O No Connection Power and Ground

AD0 64 ALE/QS0 10 RES 55 UCS 45 NC 2 V_CC 33

AD1 66 BHE (RFSH) 7 RESET 18 LCS 46 NC 11 V_CC 34

AD2 68 S0 23 X1 16 MCS0/PEREQ 39 NC 14 V_CC 72

AD3 70 S1 22 X2 17 MCS1/ERROR 40 NC 15 V_CC 73

AD4 74 S2 21 CLKOUT 19 MCS2 41 NC 24 V_SS 12

AD5 76 RD/QSMD 9 TEST/BUSY 29 PCS3/NPS 42 NC 43 V_SS 13

AD6 78 WR/QS1 8 NMI 30 PCS0 54 NC 44 V_SS 53

AD7 80 ARDY 20 INT0 31 PCS1 52 NC 62

AD8 (A8) 69 SRDY 27 INT1/SELECT 32 PCS2 51 NC 63

AD9 (A9) 67 DEN 38 INT2/INTA 36 PCS3 50

AD10 (A 10) 69 DT/R 37 INT3/INTA1 36 PCS4 49

AD11 (A11) 71 LOCK 28 PCS5/A1 48

AD12 (A12) 75 HOLD 26 PCS6/A2 47

AD13 (A13) 77 HLDA 25 TMR IN 0 59

AD14 (A14) 79 TMR IN 1 58

AD15 (A15) 1 TMR OUT 0 59

A16/S3 3 TMR OUT 1 56

A17/S4 4 DRQ0 61

A18/S5 5 DRQ1 60

A19/S6 6

Note: Pin names in parantheses apply to the 80C188XL.

Table 7. QFP Pin Locations with Pin Names

1 AD15 (A15) 21 S2 41 MCS2 61 DRQ0

2 NC 22 S1 42 MCS3/NPS 62 NC

3 A16/S3 23 S0 43 NC 63 NC

4 A17/S4 24 NC 44 NC 64 AD0

5 A18/S5 25 HLDA 45 UCS 65 AD8 (A8)

6 A19/S6 26 HOLD 46 LCS 66 AD1

7 BHE/(RFSH) 27 SRDY 47 PCS6/A2 67 AD9 (A9)

8 WR/QS1 28 LOCK 48 PCS5/A1 68 AD2

9 RD/QSMD 29 TEST/BUSY 49 PCS4 69 AD10 (A10)

10 ALE/QS0 30 NMI 50 PCS3 70 AD3

11 NC 31 INT0 51 PCS2 71 AD11 (A11)

12 V_CC 32 INT1/SELECT 52 PCS1 72 V_CC

13 V_CC 33 V_CC 53 V_CC 73 V_CC

14 NC 34 V_CC 54 PCS0 74 AD4

15 NC 35 INT2/INTA0 55 RES 75 AD12 (A12)

16 X1 36 INT3/INTA1 56 TMR OUT 1 76 AD5

17 X2 37 DT/R 57 TMR OUT 0 77 AD13 (A13)

18 RESET 38 DEN 58 TMR IN 1 78 AD6

19 CLKOUT 39 MCS0/PEREQ 59 TMR IN 0 79 AD14 (A14)

20 ARDY 40 MCS1/ERROR 60 DRQ1 80 AD7

Note: Pin names in parentheses apply to the 80C188XL.

Table 8. SQFP Pin Functions with Location

AD Bus Bus Control Processor Control I/O No Connection Power and Ground

AD0 1 ALE/QS0 29 RES 73 UCS 62 NC 4 V_CC 10

AD1 3 BHE (RFSH) 26 RESET 34 LCS 63 NC 25 V_CC 11

AD2 6 S0 40 X1 32 MCS0/PEREQ 57 NC 35 V_CC 20

AD3 8 S1 39 X2 33 MCS1/ERROR 58 NC 55 V_CC 550

AD4 12 S2 38 CLKOUT 36 MCS2 59 NC 72 V_CC 51

AD5 14 RD/QSMD 28 TEST/BUSY 46 MCS3/NPS 60 V_CC 61

AD6 16 WR/QS1 27 NMI 47 PCS0 71 V_SS 30

AD7 18 ARDY 37 INT0 48 PCS1 69 V_SS 31

AD8 (A8) 2 SRDY 44 INT1/SELECT 49 PCS2 68 V_SS 41

AD9 (A9) 5 DEN 56 INT2/INTA0 52 PCS3 67 V_SS 70

AD10 (A10) 7 DT/R 54 INT3/INTA1 53 PCS4 66 V_SS 80

AD11 (A11) 9 LOCK 45 PCS5/A1 65

AD12 (A12) 13 HOLD 43 PCS6/A2 64

AD13 (A13) 15 HLDA 43 TMR IN 0 77

AD14 (A14) 17 TMR IN 1 76

AD15 (A15) 19 TMR OUT 0 75
A16/S3 21 TMR OUT 1 74

A17/S4 22 DRQ0 79

A18/S5 23 DRQ1 78

A19/S6 24

Note: Pin names in parentheses apply to the 80C188XL.

Table 9. SQFP Pin Locations with Pin Names

1 AD0 21 A16/S3 41 V_SS 61 V_CC

2 AD8 (A8) 22 A17/S4 42 HLDA 62 UCS

3 AD1 23 A18/S5 43 HOLD 63 LCS

4 NC 24 A19/S6 44 SRDY 64 PCS6/A2

5 AD9 (A9) 25 NC 45 LOCK 65 PCS5/A1

6 AD2 26 BHE (RFSH) 46 TEST/BUSY 66 PCS4

7 AD10 (A10) 27 WR/QS1 47 NMI 67 PCS3

8 AD3 28 RD/QSMD 48 INT0 68 PCS2

9 AD11 (A11) 29 ALE/QS0 49 INT1/SELECT 69 PCS1

10 V_CC 30 V_SS 50 V_CC 70 V_SS

11 V_CC 31 V_SS 51 V_CC 71 PCS0

12 AD4 32 X1 52 INT2/INTA0 72 NC

13 AD12 (A12) 33 X2 53 INT3/INTA1 73 RES

14 AD5 34 RESET 54 DT/R 74 TMR OUT 1

15 AD13 (A13) 35 NC 55 NC 75 TMR OUT 0

16 AD6 36 CLKOUT 56 DEN 76 TMR IN 1

17 AD14 (A14) 37 ARDY 57 MCS0/PEREQ 77 TMR IN 0

18 AD7 38 S2 58 MCS1/ERROR 78 DRQ1

19 AD15 (A15) 39 S1 59 MCS2 79 DRQ0

20 V_CC 40 S0 60 MCS3/NPS 80 V_SS

Note: Pin names in parentheses apply to the 80C188XL.

Ceramic Leadless Chip Carrier (JEDEC Type A)

Figure 4. 80C186XL/80CL188XL Pinout Diagrams

Ceramic Pin Grid Array

Note: XXXXXXXXC indicates the Intel FPO number.

Figure 4. 80C186XL/80CL188XL Pinout Diagrams (continued)

Shrink Quad Flat Pack

Note: XXXXXXXXC indicates the Intel FPO number.

Figure 4. 80C186XL/80CL188XL Pinout Diagrams (continued)

Plastic Leaded Chip Carrier

80-Pin Quad Flat Pack (EIAJ)

Note: XXXXXXXXA indicates the Intel FPO number.

Figure 4. 80C186XL/80CL188XL Pinout Diagrams (continued)

Plastic Leaded Chip Carrier Package

Symbol List for Plastic Leaded Chip Carrier Family

Letter or Symbol	Description of Dimensions
A	Overall Height: Distance from seating plane to highest point of body
A₁	Distance from lead shoulder to seating plane
CP	Seating plane coplanarity
D/E	Overall package dimension
D₁/E₁	Plastic body dimension
D₂/E₂	Footprint
LT	Lead thickness
N	Total number of leads
N_d	Total number of leads on short side
N_e	Total number of leads on long side
TCP	Tweezing coplanarity

Notes: Rectangle Package

All dimensions and tolerances conform to ANSI Y14.5M-1982.
Daturn plane -H- located at top of mode parting line and coincident with top of lead, where lead exits plastics box.
Daturns A-B and -D- to be determined where center leads exit plastic body at daturn plane -H-.
To be determined at seating plane -C-.
Dimensions D₁ and E₁ do not include mode protrusion.
Pin 1 identifier is located within the defined zine.
These two dimensions determine maximum angle of the lead for certain socket applications. If unit is intended socketed, it is advisable to review these dimensions with the socket supplier.
N_d denotes the number of leads on the two short sides of the package, one of which contains pin #1. N_e denotes the number of leads of the two long sides of the package.
Controlling dimension, inch.
All dimensions and tolerances include lead trim offset and lead plating finish.
Tweezing surface planarity is defined as the furthest any lead on a side may be from the daturn. The daturn is published by touching the outermost lead on that side and parallel to A-B or -D-.

Packaging Family Attributes
Category	Plastic Leaded Chip Carrier
Acronym	PLCC
Lead Configuration	Quad
Lead Counts	28, 32, 44, 52, 68, 84
Lead Finish	SolderPlate
Lead Pitch	0.50"
Board Assembly Type	Socket and Surface Mount

Notes:

Copper Alloy Leads.
Novalac Body.
Bake and dessicant packaging required.

Family: Plastic Leaded Chip Carrier-Square (mm)
Symbol	52 Lead			68 Lead			84 Lead
Symbol	Min	Max	Notes	Min	Max	Notes	Min	Max	Notes
A	0.165	0.180		4.19	4.83		4.19	4.83
A₁	0.090	0.120		2.29	3.05		2.29	3.05
D	0.785	0.795		25.0	25.3		30.1	30.4
D₁	0.750	.0756		24.1	24.3		29.2	29.4
D₂	0.690	0.730		22.6	23.6		27.7	28.7
E	0.785	0.795		25.0	25.3		30.1	30.4
E₁	0.750	0.756		24.1	24.3		29.2	29.4
E₂	0.690	0.730		22.6	23.6		27.7	28.7
N	52			68			84
CP	0.000	0.004		0.00	0.10		0.00	0.10
TCP	0.000	0.004		0.00	0.10		0.00	0.10
LT	0.009	0.015		0.20	0.36		0.20	0.36

Family: Plastic Leaded Chip Carrier-Square (inch)

Symbol 52 Lead 68 Lead 84 Lead

Min Max Notes Min Max Notes Min Max Notes

A 01.65 0.180 0.165 0.190 0.165 0.190

A₁ 0.090 0.120 0.090 0.120 0.090 0.120

D 0.785 0.795 0.985 0.995 1.185 1.195

D₁ 0.750 0.756 0.950 0.958 1.150 1.158

D₂ 0.690 0.730 0.890 0.930 1.090 1.130

E 0.785 0.795 0.985 0.995 1.185 1.195

E₁ 0.750 0.756 0.950 0.958 1.150 1.158

E₂ 0.690 0.730 0.890 0.930 1.090 1.130

N 52 68 84

CP 0.000 0.004 0.000 0.004 0.000 0.004

TCP 0.000 0.004 0.000 0.004 0.000 0.004

LT 0.009 0.015 0.008 0.014 0.008 0.014

Figure 1. Principal Dimensions and Daturns

Figure 3. Terminal Details

Figure 4A. Standard Package Bottom View (Tooling Option I.)

Figure 4B. Standard Package Bottom View (Tooling Option II.)

Figure 5. Detail J. Terminal Detail

Figure 6. Detail L. Terminal Details

Notes Square Package:

All dimensions and tolerances conform to ANSI Y14.5M-1982.
Daturn plane -H- located at top of mold parting line and coincident with top of lead, where lead exits plastic box.
Daturns D-E and F-G to be determined where center leads exit plastic body at daturn plane -H-.
To be determined at seating plane -C-.
Dimensions D₁ and E₁ do not include mold protrusion.
Pin 1 identifier is located within one of the two defined zones.
Locations to daturn -A- and -B- to be determined at plane -H-.
These two dimensions determine maximum angle of the lead for certain socket applications. If unit is intended socketed, it is advisable to review these dimensions with the socket supplier.
Controlling dimension, inch.
All dimensions and tolerances include lead trim offset and lead plating finish.
Tweezing surface planarity is defined as the furthest any lead on a side may be from the daturn. The daturn is published by touching the outermost lead on that side and parallel to D-E or F-G.

Ceramic Pin Grid Array Package

Symbol List for Ceramic Pin Grid Array Family

Letter or Symbol	Description of Dimensions
A	Distance from seating plane to highest point of body
A₁	Distance between seating plane and base plane
A₂	Distance from base plane to highest point of body
A₃	Distance from seating plane to bottom of body
A₄	Heat spreader thickness
B	Diameter of terminal lead pin
D	Largest overall package dimension of length
D₁	A body length dimension, outer lead center to outer lead center
D₂	Head spreader length and width
e₁	Linear spacing between true lead position centerlines
L	Distance from seating plane to end of lead
S₁	Other body dimension, outer lead center to edge of body

Notes:

Controlling dimension: millimeter.
Dimesion "e₁" ("e") is non-cumulative.
Seating plane (standoff) is defined by P.C. board hole size: 0.0415-0.0430 inch.
Dimensions "B", "B₁" and "C" are normal.
Details of Pin 1 identifier are optional.

Packaging Family Attributes
Category	Ceramic Pin Grid Array
Acronym	C-PGA or PGA
Lead Configuration	Array
Lead Counts	68, 88, 132, 168-208, 240-280, 272-320
Lead Finish	Gold Plate, 60 Microinches of Gold over 100-350 Microinches of Nickel Plate
Lead Material	Kovar or Alloy 42
Lead Braze Material	Copper/Silver Eutectic
Lead Pitch	0.100"
Board Assembly Type	Socket and Insertion Mount

Notes:

Alloy 42 or Kovar Leads.
Multilayer Co-Fired Ceramic Body.
240-280 has variable pin count.

68 Lead Ceramic Pin Grid Array Package

Family: Ceramic Pin Grid Array Package (Cavity Up)
Symbol	Milimeters			Inches
Symbol	Min	Max	Notes	Min	Max	Notes
A	4.06	5.21	EPROM Lid	0.160	0.205	EPROM Lid
A	3.30	4.32	Solid Lid	0.130	0.170	Solid Lid
A₁	1.14	1.40		0.045	0.055
A₂	2.16	3.18	Solid Lid	0.085	0.125	Solid Lid
A₂	2.67	3.94	EPROM Lid	0.105	0.155	EPROM Lid
B	0.43	0.51		0.017	0.020
D	28.96	29.97		1.140	1.180
D₁	25.27	25.53		0.995	1.005
e₁	2.29	2.79		0.090	0.110
L	2.54	3.30		0.100	0.130
N	68			68
S₁	1.27	2.54		0.050	0.100

Ceramic Leadless Chip Carrier

Symbol List for Ceramic Leadless Chip Carrier Family

Letter or Symbol	Description of Dimensions
A	Thickness of base body
A₁	Total package height
A₂	Distance from base body to highest point of body (lid)
B	Width of terminal lead pin
D	Largest overall package dimension of length
D₁,E₁	A body length dimension, corner cutout to corner cutout or end lead center to end lead center
D₂,E₂	A body length dimension, end lead center to end lead center
D₃,E₃	A body length dimension, corner cutout to index corner cutout
D₄,E₄	Ceramic body fixture
E	Largest overall package dimension of width
e	Linear spacing
e₁	Linear spacing between edges of tur elead positions (of corner terminal lead pads) lead corner to lead corner
h	Depth of major index feature
j	Width of minor index feature
L	Distance from package edge to end of effective pad
N	The total number of potentially useable lead positions
R₁	Inner notch radius

Notes:

Controlling dimension: millimeter.
Dimension "e₁" ("e") is non-cumulative.
Seating plane (standoff) is defined by PC board hole size: 0.0415-0.430 inch.
Dimensions "B", "B₁" and "C" are normal.
Corner configuration optional.

Packaging Family Attributes
Category	Ceramic Leadless Chip Carrier
Acronym	LCC
Lead Configuration	N/A
Lead Counts	18, 20, 28, 32, 44, 68
Lead Finish	Gold Plate
Lead Pitch	0.050"
Board Assembly Type	Socket and Surface Mount

Notes:

68L not certified for Surface Mount, must be socketed.
Multilayer Co-Fired Ceramic Body.

68 Ceramic Leadless Chip Carrier Variation: Die Down

Family: Ceramic Leadless Chip Carrier
Symbol	Millimeters			Inches
Symbol	Min	Max	Notes	Min	Max	Notes
A	1.37	1.68		0.054	0.066
A₁	2.16	2.72		0.085	0.107
B	0.84	0.99	Typical	0.033	0.039	Typical
D	23.88	24.38		0.940	0.960
D₁	21.39	21.39		0.842	0.858
D₂	20.32		Reference	0.800		Reference
D₃	21.92		Reference	0.863		Reference
D₄	16.76	17.27		0.660	0.680
E	23.88	24.38		0.940	0.960
E₁	21.39	21.79		0.842	0.858
E₂	20.32		Reference	0.800		Reference
E₃	21.92		Reference	0.863		Reference
E₄	16.76	17.27		0.660	0.680
e	1.04	1.50	Typical	0.041	0.059	Typical
L	0.94			0.037
N	68			68
R₁		0.25			0.010

Quad Flatpack Package

Symbol List for Quad Flatpack Family

Letter or Symbol	Description of Dimensions
N	Lead Count
A	Overall Height
A₁	Stand Off
AAA	Lead True Position
B	Lead Width
C	Lead Thickness
D	Terminal Dimension
D₁	Body Package
E	Terminal Dimension
E₁	Body Package
e₁	Lead Pitch
L₁	Foot Length
T	Lead Angle
Y	Coplanarity

Note: Not all packages are available with all products. Contact local FSE for further package information.

Packaging Family Attributes
Category	Quad Flatpack
Acronym	QFP, SQFP, TQFP
Lead Configuration	Quad
Lead Counts	QFP 44, 48; 64, 80, 100, 128, 160 - SQFP 80, 100; 208 - TQFP 144, 176
Lead Finish	SolderPlate
Lead Pitch	0.5, 0.65, 0.8 mm
Board Assembly Type	Socket and Surface Mount

Note:

QFP - Alloy 42/copper on some lead frames. SQFP/TQFP copper lead frames only.
Novalac body.
Not all packages are available with all products. Contact local FSE for further package information.

Shrink Quad Flatpack
Symbol	Description	Min	Nom	Max	Min	Nom	Max	Min	Max
N	Lead Count	80			100			208
A	Overall Height			1.66			1.66	3.25	3.75
A₁	Stand Off	0.00			0.00			0	0.30
b	Lead Width	0.14	0.20	0.26	0.14	0.20	0.26	0.14	0.26
c	Lead Thickness	0.117	0.127	0.177	0.117	0.127	0.177	0.150	0.188
D	Terminal Dimension	13.70	14.00	14.30	15.70	16.0	16.30	30.2	31.0
D₁	Package Body		12.0			14.0		27.9	28.1
E	Terminal Dimension	13.70	14.0	14.30	15.70	16.00	16.30	30.2	31.0
E₁	Package Body		12.0			14.0		27.9	28.1
e₁	Lead Pitch	0.40	0.50	0.60	0.40	0.50	0.60	0.40	0.60
L₁	Foot Length	0.35	0.50	0.70	0.30	0.50	0.70	0.30	0.70
T	Lead Angle	0.0"		10.0"	0.0"		10.0"	0.0"	10.0"
Y	Coplanarity			0.10			0.10	0.1

Thin Quad Flatpack
Symbol	Description	Min	Max	Min	Max
N	Lead Count	144		176
A	Overall Height	1.3	1.7	1.3	1.7
A₁	Stand Off	0	0.20	0	0.20
b	Lead Width	0.16	0.28	0.16	0.28
c	Lead Thickness	0.122	0.160	0.122	0.160
D	Terminal Dimension	21.6	22.4	25.6	26.4
D₁	Package Body	19.9	20.1	23.9	24.1
E	Terminal Dimension	21.6	22.4	25.6	26.4
E₁	Package Body	19.9	20.1	23.9	24.1
e₁	Lead Pitch	0.40	0.60	0.40	0.60
L₁	Foot Length	0.40	0.80	0.40	0.80
T	Lead Angle	0.0"	10.0"	0.0"	10.0"
Y	Coplanarity	0.1		0.1

Note:

Dimensions are in millimeters.

Figure 3. Principle Dimensions and Data for QFP (Rectangular) Packages

Quad Flatpack (Rectangular Packages)
Symbol	Description	Min	Nom	Max	Min	Nom	Max
N	Lead Count	80			100
A	Overall Height			3.15			3.15
A₁	Stand Off	0.00			0.00
b	Lead Width	0.25	0.35	0.45	0.20	0.30	0.40
c	Lead Thickness	0.10	0.15	0.20	0.10	0.15	0.20
D	Terminal Dimension	17.5	17.9	18.3	17.5	17.9	18.3
D₁	Package Body		14.0			14.0
E	Teminal Dimension	23.5	23.9	24.3	23.5	23.9	24.3
E₁	Package Body		20.0			20.0
e₁	Lead Pitch	0.65	0.80	0.95	0.53	0.65	0.77
L₁	Foot Length	0.60	0.80	1.00	0.60	0.80	1.00
T	Lead Angle	0.0"		10.0"	0.0"		10.0"
Y	Coplanarity			0.10			0.10