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PGA to Surface Mount Foot Print, Test Head

Interconnect Systems Inc.


Architecture:
Type :
Last Update:

i960(R) Processor
Hardware Accessories

Vendor Information



Tool Description:

Interconnect Systems, Inc. has developed a PGA to QFP adapter mechanism ("Emulator Test Head") which allows users of Intel i960(R) processors to probe directly to the bare SMT footprint on their board assembly, thus solving a major test issue for high-end chip users contemplating the transition to a QFP package from a PGA package.

Tool Features:

  • Probes Directly to Fine-Pitch SMT Pads on Chip-Users Circuit Board

  • Non-Permanent Connection to SMT Pads

  • Pin-Compatible With Existing PGA Test Set-Ups

  • Development Platform(s):

    File Attachments:

    S960_157.PDF - Solutions960(R) Catalog Product Listing

    Supported Device Detail Matrix:

    Part & Package

    Availability

    80960CA - 168ldPGA
    80960CA - 196ldPQFP
    80960CF - 168ldPGA
    80960CF - 196ldPQFP
    80960HA - 168ldPGA
    80960HA - 208ldSQFP
    80960HD - 168ldPGA
    80960HD - 208ldSQFP
    80960HT - 168ldPGA
    80960JA - 132ldPGA
    80960JA - 132ldPQFP
    80960JD - 132ldPGA
    80960JD - 132ldPQFP
    80960JF - 132ldPGA
    80960JF - 132ldPQFP
    80960KA - 132ldPGA
    80960KA - 132ldPQFP
    80960KB - 132ldPGA
    80960KB - 132ldPQFP
    80960SA - 80ldQFP
    80960SA - 84ldPLCC
    80960SB - 80ldQFP
    80960SB - 84ldPLCC
    80L960JA - 132ldPQFP
    80L960JA - 168ldPGA
    80L960JF - 132ldPQFP
    80L960JF - 168ldPLCC
    82961KD - 132ldPQFP
    82961KD - 164ldPQFP

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    Vendor Information:


    Interconnect Systems Inc.

    2162 Union Place, P.O. Box 1089
    Simi Valley , CA 93065
    USA
    (805) 581-5626

    Fax : (805) 581-5032

    Contact the vendor above for the latest Distributor information




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