80- and 196-Position MICRO-PITCH Surface Mount Socket

AMP

Architecture:
Type :
Last Update:

i960(R) Processor
Hardware Accessories

Vendor Information

Tool Description:

The AMP 196-position MICRO-PITCH surface-mount socket was designed for JEDEC-approved plastic quad flat pack (PQFP) packages with preformed, gullwing leads on .025-inch contact centerline spacing. It offers a low .290-inch profile above the printed circuit board and is also available in an 80-position version.

Tool Features:

Low .290-Inch Profile Above the Board Maximizes Packaging Real Estate

Scalloped Foot Increases Solder Joint Reliability

Three Footprint Options Allow Design Flexibility

Surface-Mount Configuration Facilitates Manufacturing Process Efficiency

Development Platform(s):

196 supports Intel i960(R) Cx microprocessors/80 supports i960 Sx

File Attachments:

S960_154.PDF - Solutions960(R) Catalog Product Listing

Supported Device Detail Matrix:

Part & Package
Availability

80960CA - 168ldPGA
80960CA - 196ldPQFP
80960CF - 168ldPGA
80960CF - 196ldPQFP
80960SA - 80ldQFP
80960SA - 84ldPLCC
80960SB - 80ldQFP
80960SB - 84ldPLCC
NOW
NOW
NOW
NOW
NOW
NOW
NOW
NOW

Vendor Information:

AMP

P.O. Box 3608
Harrisburg , PA 17105
USA
(717) 564-0100

Fax : (717) 986-7575
Toll Free : (800) 522-6752

Contact the vendor above for the latest Distributor information

	Part & Package		Availability
	80960CA - 168ldPGA 80960CA - 196ldPQFP 80960CF - 168ldPGA 80960CF - 196ldPQFP 80960SA - 80ldQFP 80960SA - 84ldPLCC 80960SB - 80ldQFP 80960SB - 84ldPLCC		NOW NOW NOW NOW NOW NOW NOW NOW