Technical Alliance Program: Manufacturing Expertise for SmartDie(TM) Product Applications

SmartDie^TM Products
To address these new form factor driven applications, Intel is now offering tested die level semiconductor devices called SmartDie^TM products. Intel's SmartDie^TM products remove the concerns previously associated with procuring unpackaged silicon components. With SmartDie^TM products users can be assured that each product will provide them with quality and reliability equivalent to that of a packaged product. Since module or board manufacturing cost is directly related to individual component yield, designers can better control module and/or total system cost by using SmartDie^TM products. SmartDie^TM products take the worry out of buying die and also eliminate assembly yield uncertainty.

The New Surface Mount Trend
The trend toward greater functionality and miniaturization within the embedded computing and PCMCIA card markets is motivating OEMs to look toward new manufacturing methods. As product functionality increases, so will the need for space-saving assembly techniques. The size and weight of individual components used within these products is significantly impacting today's design. These trends are ultimately leading OEMs to work directly with die-on-board assembly techniques. Just as SMT (Surface Mount Technology) devices have all but replaced through-hole packaging, so various forms of DCA (Direct Chip Attach) are now alternatives to traditional packaged SMT.
This DCA progression in small form-factor electronic equipment will initially encounter many companies without the necessary knowledge and equipment to handle unpackaged die. Since the technology and expertise to assemble a final product using unpackaged die is capital intensive, it will be necessary for many companies to obtain third party contract manufacturing services in the near term to support their die assembly activities. To provide assistance in this area, Intel has worked to bring certain DCA assembly skills to these markets via a Technical Alliance Program (TAP) with specific contract manufacturers.

The TAP Solution
The objective of Intel's Technical Alliance Program is to provide Intel customers with access to DCA manufacturing capability. In support of this objective, Intel has established technical support relationships with several contract manufacturers, all of which are technically capable of design and/or assembly of unpackaged die into small form factor electronic equipment (e.g., PC cards, few chip modules). By providing information and support from Intel's program, the manufacturers are able to provide the end customer with a board or module assembly solution very quickly. When time-to-market is the difference between success and failure, this additional support may be the key factor for success.
The traditional arrangement that exists between an OEM and a contract assembly manufacturer is left unaltered. With this program, that relationship will be strengthened by the information sharing between Intel and the TAP participants. The key advantage for the customer is having expert assistance in sorting through all the alternatives (COB, multichip packages, etc.) and recommending the best assembly technique and substrate material during the design phase. Depending upon the customer's need, the contractor can then take it through all the manufacturing processes and final test on the sub-assembly, up to a total turn-key operation. By utilizing the contract manufacturers' expertise, Intel can provide not only the industry's most reliable tested die products, but also the best total solution for small form factor products via its TAP partners.
Intel is providing in-depth technical support on SmartDie^TM products to assist the contract manufacturers in designing with and using Intel devices. Intel and the contract manufacturers have been working together to understand the unique requirements of die-based manufacturing. This work has been very important in understanding the way Intel die products perform in various customer applications. The support is provided directly from Intel by technical experts in such fields as:

Manufacturing engineering
Quality and Reliability engineering
Product engineering
Applications engineering

To continuously improve product quality, delivery systems and business relationships, Intel and the TAP partners review SmartDie^TM products and the Technical Alliance Program on a regular basis. This review process ensures that Intel receives timely, proactive feedback on the SmartDie^TM family of products in order to provide the right products to the customer, at the right time.
Initial TAP participants include ANAM/AMKOR; Jabil Circuit Inc.; MicroModule Systems; SCI Sytems, Inc.; SMOS; Solectron; and Valtronic USA, Inc.
For an up-to-date list of Intel's TAP participants and their capabilities, please contact your local Intel sales office or authorized distributor.

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