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Intel's Small Outline Package (SOP) Family Product Brief

Product Overview

Intel provides a complete range of small-package solutions for 1-Mb flash memory and beyond. Small outline packaging (SOP), an established industry standard, significantly reduces board space consumed by devices. The Intel SOP family quickens time to market and pro-vides flexibility by offering pin-to-pin compatible densities, making it easier to implement expanded code without the need to redesign. Intel's pin-to-pin compatible density starts at 2 Mb, so you can convert to 2-Mb packaging today and be ready for a 4 Mb and an 8 Mb tomorrow. In addition, the SOP family's proven gull-wing lead and dual in-line design provides improvements over traditional packages. As an example, the SOP family offers improved lead inspection, board routing and solder joints over the plastic-leaded chip carrier (PLCC).

Product Description

The Intel SOP family includes the Thin Small Outline Package (TSOP), the Plastic Small Outline Package (PSOP) and the Shrink Small Outline Package (SSOP). All three packages offer x8 or x16 organization options. The x16 option reduces component count, power consumption and space. The PSOP x16 device replaces two x8 32-lead PLCC devices, reduc-ing required space by thirty percent.

The TSOP--the smallest flash package-- incorporates a small form factor and is ideal for sophisticated functions where size and portability are primary design concerns. It is ideal for such applications as cellular phones, PC BIOS, networks, PCMCIA cards, mass storage, fax/modems, arcade games and printers. The TSOP supports densities from 1 Mb to 32 Mb.

The PSOP--the plastic small outline package-- is rugged, is easy to use and supports Intel's mid-density architectures. It is particularly well suited in applications that must withstand extreme temperatures. It is best used for medical and industrial embedded applications and in office settings for printer servers and fax/modems.

The SSOP--the shrink small outline package-- can handle both rugged conditions and higher densities. Like the PSOP, it offers great endurance and is easy to implement. Ideal applications include telecommunications, switches, networking and base stations.

Key Features

  • PSOP & SSOP rugged and easy to use
  • TSOP for space-constrained applications
  • 1.2 mm height
  • Pin-out compatibility
  • Upgrade path of 2, 4 and 8 Mb
  • SmartVoltage technology
  • 3.3V low power read
  • Single power supply 5V operations
  • 12V fast programming/erase mode
    		•
  • x8/x16 organization
  • Lower component count
  • 30% space reduction
  • Dual in-line package
  • Easy implementation into manufacturing
  • Complete socket options
  • Production, manufacturing and prototyping
  • Quick removal and insertion
  • JEDEC compliant
    • FEATURES BENEFITS
  • Compatible density upgrade path
    		•
  • Flexibility and room for code growth
  • For 2, 4 and 8 Mb
    		•
  • SmartVoltage operating choices
    		•
  • 3.3V low power read
  • Single 5V power supply read/write
  • 12V fast programming/erase
  • More than twice as fast as 5V device
    		•
  • x8/x16 organization
  • Lower x16 component count
  • Reduced space and power consumption
    		•
  • Dual in-line gull-wing lead package
    		•
  • Industry standard (JEDEC-compliant)
  • Easy inspection at assembly
    		•
  • Footprint compatible sockets
  • Quick conversion from prototyping to full production
    		•

    PACKAGE TYPE NO. OF
    LEADS    		 DENSITY ORGANI
    ZATION    		 PACKAGE SIZE APPLICATIONS/MARKETS
    TSOP
    Lead
    Pitch
    .5 mm (19.7 mil)    		 32
    40


    48

    56

    		 1-2 Mb
    2-4 Mb


    2-8 Mb

    2-32 Mb

    		 x8
    x8


    x8/x16

    x8/x16

    		 8 mm x20 mm
    10 mm x20 mm


    12 mm x20 mm

    14 mm x20 mm

    		 Handheld/notebook (i.e., PC BIOS, PCMCIA, scanners)
    Cellular/wireless (i.e., cell phones, radios, wireless LANs)
    PC platform (i.e., BIOS, ROM OS, HDDs, PCMCIA cards)
    Consumer (i.e., answering machines, games, set-tops)
    Cellular/wireless
    Office automation (i.e., laser printers, fax, printer servers)
    Handheld/notebooks
    PC platform
    PSOP
    1.27 mm (50 mil)    		442-8 Mbx8/x1628.2 mm x16 mmDatacom/networking (i.e., routers, switches, fax/modems, NICs)
    PC platform
    Telecom (i.e., PBX, CO switches, SLCs)
    Office automation
    Consumer
    SSOP
    .8 mm (31.5 mil)    		5616 Mbx8/x1623.7 mm x16 mmDatacom/networking
    Telecom

    Support Tools

    New tools are being developed that exceed features of other packages' tools. PSOP and SSOP are easily implemented into existing 50 mil assembly infrastructures. Programming tools as well as prototype and production sockets are readily available. For more information, consult the Small Outline Package Guide (Order Number 296514) or call Intel.

    Intel Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in an Intel product. No other circuit patent licenses are implied. Information contained herein supercedes previously published specifications on these devices from Intel. *Other brands and names are the property of their respective owners.



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