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Overview: Small Outline Package Guide

v1.1

Intent       This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514.
Contents The table below details, in outline form, the type of information that can be found in the guide.
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ChapterContents
Package Description
  • Small-form-factor/fine-pitch introduction
  • TSOP, SSOP and PSOP key features
  • Device/package offerings
  • SOP Layout Features & Applications
  • Space-saving features
  • Device pinouts
  • SOP applications
  • SOP Physical Dimensions
  • Package drawings and specifications
  • PCB land-pad layout diagrams
  • Component volume and weight
  • SOP Package Characteristics
  • Electrical characteristics
  • Thermal data
  • SOP Manufacturing
  • Assembly process flow
  • Package materials
  • Cross-section diagrams
  • Electrical and solderability test
  • Mechanical inspection
  • SOP Reliability Stresses
  • Temperature cycling via convection
  • Thermal shock, liquid-to-liquid stress
  • Steam, accelerated moisture penetration stress
  • 85°C / 85% relative humidity, alternate pins biased (+5V and GND)
  • High-temperature dynamic life test
  • Solder-joint reliability
  • Surface mount process considerations
  • Use condition considerations
  • Solder-joint life predictions curves
  • SOP Handling
  • SOP shipping formats
  • Tray diagrams and dimensions
  • Tray recycling
  • Tape and reel carrier diagrams and dimensions
  • Tube diagrams and dimensions
  • Moisture considerations and data
  • Moisture Sensitivity Classification Levels
  • Preconditioning flow
  • Test Conditions Table
  • SOP Moisture Reliability Levels
  • Moisture Absorption and Desorption
  • SOP SMT Assembly Considerations
  • Storage and handling
  • Screen printing
  • Solder paste
  • Solder volume
  • Solder mask
  • Stencil
  • Vision system
  • Squeegee
  • Placement equipment
  • Cleaning
  • IR furnace
  • PCB design considerations
  • Lead placement examples:
  • Good placement
  • Misaligned
  • Lifting
  • SOP Ordering Information
  • Product/package identification
  • References and Additional Information
  • Other reference material
  • Appendix A: SOP Support Tools
  • SOP vacuum wand suppliers
  • SOP programming adapter suppliers
  • SOP Distribution Programming Support
  • SOP Independent Programming Houses
  • SOP socket suppliers
  • Prototyping sockets
  • Production sockets
  • Burn-in/Programming sockets
  • SOP Programmer and Handler Vendors
  • SOP Manufacturing equipment suppliers
  • SOP custom board manufacturing and interposer mounting
  • Appendix B: References
  • SOP Reference Articles
  • Appendix C: SOP Standards Bodies
  • EIA/JEDEC
  • ANSI
  • IPC
  • EIAJ


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