Overview: Small Outline Package Guide

Intent		This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514.
Contents		The table below details, in outline form, the type of information that can be found in the guide.
How to Order		Phone: (800) 548-4725 in US and Canada Outside US/Canada, contact local Intel or distributor sales office or write to: Intel Corporation Literature Sales PO Box 7641 Mt. Prospect, IL 60056-7641

Chapter	Contents
Package Description	Small-form-factor/fine-pitch introduction TSOP, SSOP and PSOP key features Device/package offerings
SOP Layout Features & Applications	Space-saving features Device pinouts SOP applications
SOP Physical Dimensions	Package drawings and specifications PCB land-pad layout diagrams Component volume and weight
SOP Package Characteristics	Electrical characteristics Thermal data
SOP Manufacturing	Assembly process flow Package materials Cross-section diagrams Electrical and solderability test Mechanical inspection
SOP Reliability Stresses	Temperature cycling via convection Thermal shock, liquid-to-liquid stress Steam, accelerated moisture penetration stress 85°C / 85% relative humidity, alternate pins biased (+5V and GND) High-temperature dynamic life test Solder-joint reliability Surface mount process considerations Use condition considerations Solder-joint life predictions curves
SOP Handling	SOP shipping formats Tray diagrams and dimensions Tray recycling Tape and reel carrier diagrams and dimensions Tube diagrams and dimensions Moisture considerations and data Moisture Sensitivity Classification Levels Preconditioning flow Test Conditions Table SOP Moisture Reliability Levels Moisture Absorption and Desorption
SOP SMT Assembly Considerations	Storage and handling Screen printing Solder paste Solder volume Solder mask Stencil Vision system Squeegee Placement equipment Cleaning IR furnace PCB design considerations Lead placement examples: Good placement Misaligned Lifting
SOP Ordering Information	Product/package identification
References and Additional Information	Other reference material
Appendix A: SOP Support Tools	SOP vacuum wand suppliers SOP programming adapter suppliers SOP Distribution Programming Support SOP Independent Programming Houses SOP socket suppliers Prototyping sockets Production sockets Burn-in/Programming sockets SOP Programmer and Handler Vendors SOP Manufacturing equipment suppliers SOP custom board manufacturing and interposer mounting
Appendix B: References	SOP Reference Articles
Appendix C: SOP Standards Bodies	EIA/JEDEC ANSI IPC EIAJ

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