| Architecture: Type : Last Update: | FLASH Bulk-Erase_Component Programmer - Gang 7/29/96 10:41:00 AM | Vendor Information |
|
A description for this tool is being worked on. |
Tool Features:
|
|
File Attachments:
Supported Device Detail Matrix:
| Part - Package | Revision | Status | Availability | Module | Adapter | ||||||
| 28F010-Plastic Dip-32 ld 28F010-PLCC-32 ld 28F010-TSOP-32 ld 28F010-TSOP-32 ld(R) 28F020-Plastic Dip-32 ld 28F020-PLCC-32 ld 28F020-TSOP-32 ld 28F020-TSOP-32 ld(R) | 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 | Released Released Scheduled Scheduled Released Released Scheduled Scheduled | AVAILABLE AVAILABLE AVAILABLE AVAILABLE AVAILABLE AVAILABLE AVAILABLE AVAILABLE | MODXP1-GD32 MODXP1-GP32 MODXP1-GD32 MODXP1-GD32 MODXP1-GD32 MODXP1-GP32 MODXP1-GD32 MODXP1-GD32 | Not Required Not Required AS-32-32-01TS-6YAM-S, CIC-32TS-32D-A6-ENP-S AS-32-32-01TS-6YAM-R, CIC-32TS-32D-A6-ENP-R Not Required Not Required AS-32-32-01TS-6YAM-S, CIC-32TS-32D-A6-ENP-S AS-32-32-01TS-6YAM-R, CIC-32TS-32D-A6-ENP-R |
|
130-A Capital Drive |
|
Email : logdev@henge.com |
Contact the vendor above for the latest Distributor information
