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Small Outline Package Guide Overview

Intel Corp. (Folsom)


Architecture:
Type :
Last Update:

FLASH Fast Flash_Component
Packaging Information
8/15/96 11:15:00 AM

Vendor Information



Tool Description:

Provides a quick reference for the SOP package guide which covers SOP package related topics such as package descriptions, deminsions, characteristics, manufacturing, reliability, handling, assembly considerations, ordering Info, and tools

Tool Features:

  • Tools and ordering information

  • Manufacturing, reliability, handling and assembly considerations

  • SOP characteristics

  • SOP Package descriptions/ deminsions
  • File Attachments:

    2291R25.DOC -

    Supported Device Detail Matrix:

    Part & Package

    28F016XD - TSOP-56 ld
    28F016XS - SSOP-56 ld
    28F016XS - TSOP-56 ld



    Vendor Information:


    Intel Corp. (Folsom)

    1900 Prairie City Road
    Folsom , CA 95630
    USA

    Tech : (916) 356-3104
    Email : flash@inside.intel.com
    Fax : (916) 356-2803
    Toll Free : (800) 628-8686
    BBS : (916) 356-3600
    URL : http://developer.intel.com

    Contact the vendor above for the latest Distributor information




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