Small Outline Package Guide Overview

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

FLASH Bulk-Erase_Component
Packaging Information
8/15/96 11:15:00 AM

Vendor Information

Tool Description:

Provides a quick reference for the SOP package guide which covers SOP package related topics such as package descriptions, deminsions, characteristics, manufacturing, reliability, handling, assembly considerations, ordering Info, and tools

Tool Features:

Tools and ordering information

Manufacturing, reliability, handling and assembly considerations

SOP characteristics

SOP Package descriptions/ deminsions

File Attachments:

2291R25.DOC -

Supported Device Detail Matrix:

Part & Package

28F010 - TSOP-32 ld
28F010 - TSOP-32 ld(R)
28F020 - TSOP-32 ld
28F020 - TSOP-32 ld(R)

Vendor Information:

Intel Corp. (Folsom)

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

	Part & Package
	28F010 - TSOP-32 ld 28F010 - TSOP-32 ld(R) 28F020 - TSOP-32 ld 28F020 - TSOP-32 ld(R)