Wells Sockets (Burn-in/Test)

The Wells range of test and burn-in sockets have become a standard for flash manufacturers and users around the world. All popular flash package types and sizes are available, including Intel's PSOP and TSOP packages. Proven high force, high reliability and long life contact design provides excellent electro-mechanical interface with flash device leads for test applications under a variety of environments. Standard gold plating and high temperature/high impact engineering plastics assure long life even in high stress and harsh environmental applications. Well's TSOP sockets are designed to accept both live bug (normal bend) and dead bug (reverse bend) devices in the same socket, minimizing test/burn-in board and socket investment. The open top, compact design of TSOPs and PSOPs insures minimal usage of board real estate. 100% incoming and outgoing inventory inspection assures zero defect shipments. Modular tool design allows for quick response to new size requirements. As a world leader in flash application socketry, Wells provides off-the-shelf delivery for all popular sizes and fast turnaround for new sizes.