Architecture: Type : Last Update: | FLASH Bulk-Erase_Component Lead Inspection Equipment 8/20/96 12:50:00 PM | Vendor Information |
The LS-3700 is a 3-D machine vision-based component inspection system. The system inspects a variety of leaded and grid array components, without physical contact, while seated in their trays. The software includes modules that gather high resolution 3-dimensional data from the surface of the leads, make geometric measurements and determine if components are within specified limits. Scanning of Intel Flash components in PSOP, SSOP, TSOP and other surface mount packages are all available on RVSI lead scanning products. The system software is divided into four major sections: |
Tool Features:
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File Attachments:
SOLF_073.PDF - SolutionsFlash Memory Catalog Product Listing |
Supported Device Detail Matrix:
Part & Package | Status | Availability | |||||||
28F010 - TSOP-32 ld 28F010 - TSOP-32 ld(R) 28F020 - TSOP-32 ld 28F020 - TSOP-32 ld(R) | Released Released Released Released | AVAILABLE AVAILABLE AVAILABLE AVAILABLE |
425 Rabro Drive East |
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Fax : (516) 273-1167 |
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